TI中文支持网Part Number:MSP430FR5729
During the checking of the operability of our finished products in heat conditions, at a temperature of 70℃, a malfunction was detected. As a result of the tests, it was revealed that there is no possibility of information exchange devices using the PLC module, due to a mismatch of the chip
Yale Li：
I strongly suggest you post your issue to E2E directly. The relevant R&D engineer will support you directly.
