Part Number:TMS570LC4357-EPOther Parts Discussed in Thread:TMS570LC4357
现在有两份工程，一份是bootloader工程，一份是app工程，TMS570LC4357片内FLASH存放bootloader，FPGA的SRAM里存放APP，TMS570和FPGA用EMIF通讯。我现在想让bootloader运行结束后，直接跳转到FPGA挂载SRAM里的APP程序，我应该怎么做？
你好，这是同一个问题吧？还请先回复下帖：
e2echina.ti.com/…/tms570lc4357-ep-tms570lc4357-fpga-sdram
TMS570LC4357: TMS570LC4357PIN TO PIN替代问题TMS570LC4357: 备用TMS570通过JTAG烧写主用TMS570的program flashTMS570LC4357: TMS570LC4357 LWIP RMII PING 问题
TMS570LC4357: TMS570LC4357 LWIP RMII PING 问题
TMS570LC4357: We have adopted the RMII mode circuit design for the Ethernet interface from the TMS570LC4357 HDK development board. However, we are unable to ping the computer host.TMS570LC4357: 关于EMAC驱动EMACSwizzleData问题TMS570LC4357: 在Flash擦写的同时执行(POM相关)TMS570LS3137-EP: TMS570LS3137-EP
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