TI中文支持网
TI专业的中文技术问题搜集分享网站

请问配对里GAP_BONDINGS_MAX可以修改么

各位下午好,

请问GAP_BONDINGS_MAX大小可以修改么?有受其制约的配置么?

Susan Yang:

e2e.ti.com/…/500799

The size of a bond record can vary from device and stack version, however you can find the size by inspecting the SNV flash page. Simply program the device and power it up. Then use Flash Programmer (version for your device) and view the SNV page. For recent CC2640R2 SDKs that use OSAL_SNV=1, this will be page 30. The address of the last programmed byte that is not 0xFF is the baseline SNV usage. Then pair/bond a device and repeat the measurement. The delta in flash size usage is the size of the bond record. On recent CC2640R2 SDKs, this is approx. 92 bytes.

赞(0)
未经允许不得转载:TI中文支持网 » 请问配对里GAP_BONDINGS_MAX可以修改么
分享到: 更多 (0)