LDC507X-SENSOR-DESIGN-TOOL: Inquiry About Coil Design for LDC5072

I am currently working on a design utilizing the LDC5072 inductive sensing solution and have a question regarding the recommended coil placement in the PCB stackup. In the GERBER file designed by the design tool, the coil is typically designed on the top and bottom layers of the PCB.

My question is:
Could the coil be placed on the top layer and an inner layer (e.g., Layer 2), while using Layer 3 as a solid ground plane and placing the LDC5072 and other components on Layer 4?

If there are additional guidelines or simulation data available for non-standard coil placements, I would greatly appreciate your insights.

Lydia：

您好，

已经收到了您的案例，调查需要些时间，感谢您的耐心等待