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BQ28Z610-R1: Sleep状态下,实测保护延时和恢复延时与设定的时间值差别太大

Part Number:BQ28Z610-R1Other Parts Discussed in Thread:BQ28Z620, BQ28Z610

dsg relax time/chg relax time的值都为1,连着通讯,保护和恢复的时间都是正常的。

一旦断开通讯,芯片进入sleep状态,再次测量,OCD恢复时间设定为5S时,实测恢复时间27.5S,设定为10S时,实测恢复时间为42.5S。请问如何解释这个现象?如何解决?虽然在DA configuration中将SLEEP设定为0,关闭休眠后可以暂且解决,但是随之引起的功耗也无法避免。

同样的设定条件,芯片bq40z50r2在Sleep状态不会引起保护延时和恢复时间的变化。

Star Xu:

您好,正在询问更了解这款芯片的TI工程师,稍后回复。

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xiaojuan xiao:

谢谢,关注到官网上提到bq28z610r2的firmware(没有找到下载链接),下载到了r2的trm(technical reference manual)。也关注到有芯片的升级bq28z620。可以麻烦指导一下这其中的变化和建议如何使用吗?

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Star Xu:

您好,The bq28z610 srec and GG file cannot be used directly on bq28z620. If the cells are the same, then you can program the same chem ID without having to match again. And data memory parameters can be copied manually. However the learning cycle will have to be run again to generate a new golden image.

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xiaojuan xiao:

We 're using bq28z610r1 at present  and  encountered an unexplained phenomenon which was described above.For example,when bq28z610r1 is in sleep mode, the OCD actual delay time and recovery delay time wil l be such as 10s and 18s with setting value 3s and 5s.Is this bq28z610r2 upgrade to solve the this problem?can u please send a R2 firmware or upgraded R1firmware to us?TI website can't download now.We're curious what are the detailed differences between the firmware cause there're little description about the change beween R1toR2 or 28z610to28z620.Thanks!

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Star Xu:

您好,请参考下面内容

Conditions to enter and exit Sleep Mode:

Note: The device does not perform any protections during SLEEP mode. It will transition to NORMAL mode after the conditions have been met, and then perform the OCD protection if qualifies. In seep mode, the DSG is OFF and the CHG is OFF if DA Configuration[SLEEPCHG] = 0.Once the device is in SLEEP mode, it will wake up every Sleep:Voltage Time period to measure voltage and temperature and  every Sleep:Current Time period to measure current. Check the settings for these two parameters. By default:

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xiaojuan xiao:

[sleepchg] is in FET options .Now it's set to keep DSG and CHG on in sleep mode.If discharge begins,i thought that WAKE COMPARATOR will be activated at once and exit sleep mode,cause it meet the wake voltage threthold.0.0625mv.Whether I misunderstood anyting?

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Star Xu:

您好,是的,您的理解是对的,wake comparator default 是+-0.625mV

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xiaojuan xiao:

在休眠模式充放电管都on的情况下,请问采样电阻的压差超过该值会立即退出休眠模式吗?

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xiaojuan xiao:

设定sleep时充放电管都on,绿色为放电电流,蓝色为P+电压。前面两次放电过流时在通讯,保护时间2秒恢复时间4秒,第三次前断开通讯,大概5秒后进入sleep状态,第四次保护时间16秒恢复时间8秒,之后保护时间2秒,恢复时间8秒。这种时间的不可控性,会导致超过PCB或者线材当初的热设计上限,比较关注。

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Star Xu:

您好,The CHG FET should remain ON during sleep mode for current to be sensed in the sense resistor. Make sure SLEEPCHG is set (see below). This will allow charging current to flow during Sleep mode.

As stated in the above picture, two of the conditions for the gauge to exit sleep mode is:1- if the current() (sensed) > sleep current threshold2- if  wake comparator activates. I believe you are referring to the wake comparator option. If so, correct. The device will wake up if the voltage across the SRP and SRN pins exceed +/- 0.625 mV when Power: Wake Comparator is set to WK1:WK0 [00]

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